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Keywords [ aluminum extrusion heat sink ] match 673 Products.
IP55 Copper Pipe Heat Sink Efficient Heat Dissipation 0.01mm Tolerance
| Bonding Technique: | Epoxy Gluing |
|---|---|
| Process: | CNC Machining, Soldering, Nickle Plating, Leakage Testing |
| Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |
Automatic Tube Forming Machining Copper Pipe Heat Sink Aluminum Fin Copper CPU Heatsink
| Finishing: | Anodizing Or Passiviation |
|---|---|
| Part Weight: | 330G,450G,1.5KG,depends On Your Size |
| Surface Treatment: | Black Anodize |
Anti Anodizing Aluminum Copper Heat Pipe Heatsink Custom Shape
| Surface Treatment: | Black Anodize |
|---|---|
| Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
| Shape: | Custom |
Extrusion Copper Heat Pipe Heatsink With 8mm Heat Pipe Diameter
| Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
|---|---|
| Finishing: | Anodizing Or Passiviation |
| Finishing: | Anti Anodizing |
GS 100W Anodizing Extrusion Aluminum Heat Sinks Plating For Device
| Material: | Aluminum 6063 6061 |
|---|---|
| Color: | Silver |
| Application: | LED Light, Air Condition |
Computer / CPU Copper Tube Heat Sink Stamping Processing Epoxy Gluing Bonding
| Bonding Technique: | Epoxy Gluing |
|---|---|
| Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
| Application: | For Computer, CPU |
Passiviation Copper Pipe Heat Sink Epoxy Gluing Bonding Extruded Aluminum Heatsink
| Processing: | Stamping,Automatic Tube Forming Machining,Overflow Welding/Drying Machine |
|---|---|
| Surface Finish: | Mill Finish Or Custom |
| Finishing: | Anodizing Or Passiviation |
Durable chipset cooler , Aluminum heat sink for chipset memory card
| Packaging Details: | Part in Plastic Tray, then in Cartons, Wooden Pallet on Bottom, Film wrapped overall then Nylon belt fastened Or to be Customized Means of Packing. |
|---|---|
| Delivery Time: | MOQ 1 Week, 150,000pcs 4 Weeks. |
| Payment Terms: | TT, L/C |
High Power Led heat sink Customized Aluminum Zipper Fin Heatsink With Heat pipe Heatsink for transistor
| Material: | Aluminum 6063 6061 |
|---|---|
| Color: | Silver |
| Application: | LED Light, Air Condition, Equipment, Device |
Forging Copper Pipe Heat Sink +/-0.01mm Tolerance Customized Heat Pipe Diameter 8mm
| Power: | 500W, |
|---|---|
| Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |
| Bonding Technique: | Epoxy Gluing |