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Contact Person : Carl Peng
Phone Number : 86-13925550965
Whatsapp : 8613925550965
Keywords [ aluminum extrusion heat sink ] match 662 products.
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Automatic Tube Forming Machining Copper Pipe Heat Sink Aluminum Fin Copper CPU Heatsink

Finishing: Anodizing Or Passiviation
Part Weight: 330G,450G,1.5KG,depends On Your Size
Surface Treatment: Black Anodize
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Extrusion Copper Heat Pipe Heatsink With 8mm Heat Pipe Diameter

Process Capability: Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting.
Finishing: Anodizing Or Passiviation
Finishing: Anti Anodizing
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IP55 Copper Pipe Heat Sink Efficient Heat Dissipation 0.01mm Tolerance

Bonding Technique: Epoxy Gluing
Process: CNC Machining, Soldering, Nickle Plating, Leakage Testing
Material: Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006).
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Anti Anodizing Aluminum Copper Heat Pipe Heatsink Custom Shape

Surface Treatment: Black Anodize
Process Capability: Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting.
Shape: Custom
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Passiviation Copper Pipe Heat Sink Epoxy Gluing Bonding Extruded Aluminum Heatsink

Processing: Stamping,Automatic Tube Forming Machining,Overflow Welding/Drying Machine
Surface Finish: Mill Finish Or Custom
Finishing: Anodizing Or Passiviation
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Durable chipset cooler , Aluminum heat sink for chipset memory card

Packaging Details: Part in Plastic Tray, then in Cartons, Wooden Pallet on Bottom, Film wrapped overall then Nylon belt fastened Or to be Customized Means of Packing.
Delivery Time: MOQ 1 Week, 150,000pcs 4 Weeks.
Payment Terms: TT, L/C
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GS 100W Anodizing Extrusion Aluminum Heat Sinks Plating For Device

Material: Aluminum 6063 6061
Color: Silver
Application: LED Light, Air Condition
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Forging Copper Pipe Heat Sink +/-0.01mm Tolerance Customized Heat Pipe Diameter 8mm

Power: 500W,
Material: Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006).
Bonding Technique: Epoxy Gluing
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Computer / CPU Copper Tube Heat Sink Stamping Processing Epoxy Gluing Bonding

Bonding Technique: Epoxy Gluing
Process Capability: Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting.
Application: For Computer, CPU
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IP55 Copper Tube Heat Sink Stamping 0.4mm Aluminum Fin Customized

Tolerance: +/-0.01mm
Heat Pipe Diameter: 8mm,etc.Customized
Shape: Custom
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