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Keywords [ aluminum heat sink extrusions ] match 662 products.
Computer / CPU Copper Tube Heat Sink Stamping Processing Epoxy Gluing Bonding
| Bonding Technique: | Epoxy Gluing |
|---|---|
| Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
| Application: | For Computer, CPU |
Aluminum Plate Copper Pipe Heat Sink With Anodizing/Passivation Power
| Customized: | OEM Or ODM |
|---|---|
| Tolerance: | +/-0.01mm |
| Processing: | Stamping,Automatic Tube Forming Machining,Overflow Welding/Drying Machine |
Long Lasting And Efficient Copper Tube Heat Sink IP55 For CPU Application
| IP Rating: | IP55 |
|---|---|
| Power: | 500W, |
| Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
Anodizing / Passiviation Copper Pipe Heat Sink For Improved Heat Dissipation
| Finishing: | Anti Anodizing |
|---|---|
| Customized: | OEM Or ODM |
| Material: | Aluminum+Copper |
Efficient Cooling Solution Copper Pipe Heat Sink With Anti Anodizing Finish
| Part Weight: | 330G,450G,1.5KG,depends On Your Size |
|---|---|
| Material: | Aluminum+Copper |
| Aluminum Fin Thickness: | 0.4mm |
IP55 Copper Pipe Heat Sink With Die Casting Process And Black Anodize
| Finishing: | Anti Anodizing |
|---|---|
| Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
| Application: | For Computer, CPU |
Silver Anodize Aluminum Extruded Heat Sink Thermal Resistance For Computer
| Packaging Details: | Part in Plastic Tray, then in Cartons, Wooden Pallet on Bottom, Film wrapped overall then Nylon belt fastened Or to be Customized Means of Packing. |
|---|---|
| Delivery Time: | MOQ 1 Week, 150,000pcs 4 Weeks. |
| Payment Terms: | TT, L/C |
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Extrusion Air Cooled Heat Sink , T5 T6 Alu Square Anodized Heat Sink
| Shape: | Square,Angle |
|---|---|
| Alloy Or Not: | Is Alloy,Non-alloy |
| Application: | Heat Sink,Decorations,Industrial,cpu |
Aluminum Fin Heat Sink With Copper Pipe 99.5% Purity Stamping Power
| Shape: | Custom |
|---|---|
| Material: | Aluminum+Copper |
| Aluminum Fin Thickness: | 0.4mm |
Epoxy Gluing Bonded Copper Tube Heat Sink 1.5KG Weight Anti Anodizing
| Bonding Technique: | Epoxy Gluing |
|---|---|
| Size: | Customized |
| Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |