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Contact Person : Carl Peng
Phone Number : 86-13925550965
Whatsapp : +8613925550965
Keywords [ aluminum heatsink extrusion ] match 424 products.
buy Computer / CPU Copper Tube Heat Sink Stamping Processing Epoxy Gluing Bonding online manufacturer

Computer / CPU Copper Tube Heat Sink Stamping Processing Epoxy Gluing Bonding

Bonding Technique: Epoxy Gluing
Process Capability: Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting.
Application: For Computer, CPU
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Raspberry Heatsink Pi 4B for PCB Aluminum Silver Heatsink 4 sets With Adhesive Tape Aluminum Cooler

Material: Aluminum Alloy
Process: Extrusion
Color: Silver
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Material:: Aluminum
Packing:: As Your Request
Delivery Time:: 7-14 Days
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Epoxy Gluing Copper Pipe Heat Sink IP55 Mill Finish Custom

Shape: Custom
Application: For Computer, CPU
Aluminum Fin Thickness: 0.4mm
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IP55 Copper Pipe Heat Sink Efficient Heat Dissipation 0.01mm Tolerance

Bonding Technique: Epoxy Gluing
Process: CNC Machining, Soldering, Nickle Plating, Leakage Testing
Material: Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006).
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Raw Material: Aluminum Plate And Copper Pipes
Shape: Custom
Finishing: Anti Anodizing
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Place Of Origin: Guangdong China (mainland)
Brand Name: LIFONG
Heatsink Material: Copper Fin, Copper And Aluminum
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Forging Copper Pipe Heat Sink +/-0.01mm Tolerance Customized Heat Pipe Diameter 8mm

Power: 500W,
Material: Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006).
Bonding Technique: Epoxy Gluing
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OEM Aluminum Skiving Fin Cooler Skived Fin Dissipation Heatsink For AutoMobile

Product: Heat Sink Skiving , Skiving Heat Sink
Material: Copper
MoQ: 100
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