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Keywords [ copper heat sink ] match 563 products.
Anti Anodizing Copper Pipe Heat Sink Customizable Design And Efficient Performance
Size: | Customized |
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Material: | Aluminum+Copper |
Heat Pipe Diameter: | 8mm,etc.Customized |
Aluminum Plate Copper Tube Heat Sink For High Precision Applications
Surface Finish: | Mill Finish Or Custom |
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Size: | Customized |
Shape: | Custom |
Extrusion Copper Heat Pipe Heatsink With 8mm Heat Pipe Diameter
Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
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Finishing: | Anodizing Or Passiviation |
Finishing: | Anti Anodizing |
Skiving Process Extruded Aluminum Heatsink Copper Pipe Heat Sink For Projector
Application: | For Computer, CPU |
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Heat Pipe Diameter: | 8mm,etc.Customized |
IP Rating: | IP55 |
Anti Anodizing Copper Heat Pipe Heatsink High Power With Aluminum Plate
Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |
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IP Rating: | IP55 |
Application: | For CUP, PC, Server Projector |
Epoxy Gluing Bonded Copper Tube Heat Sink 1.5KG Weight Anti Anodizing
Bonding Technique: | Epoxy Gluing |
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Size: | Customized |
Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |
Customizable Cooling Solution Copper Heat Pipe Heatsink with 0.4mm Aluminum Fins
Material: | Aluminum+Copper |
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Part Weight: | 330G,450G,1.5KG,depends On Your Size |
Bonding Technique: | Epoxy Gluing |
8mm Copper Pipe Heat Sink Microchannel With Epoxy Gluing For Computer
Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |
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Aluminum Fin Thickness: | 0.4mm |
Size: | Customized |
Aluminum Plate Copper Pipe Heat Sink For Superior Thermal Management
Tolerance: | +/-0.01mm |
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Material: | Pure Copper C1100 Strips, Purity Over 99.5% (Standard: JIS H3250-2006); Pure Aluminum Board A1060 Purity Over 99.6% .(Standard: GB/T3880-2006). |
Bonding Technique: | Epoxy Gluing |
Overflow Welding Aluminum Fin Heat Sink With Copper Pipe For Computer Application
Process Capability: | Extrusion, Skiving, CNC Machining, Stamping, Forging, Die-casting, FSW,Soldering, Brazing, Anodize, Nick Plating, Sand Blasting. |
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Heat Pipe Diameter: | 8mm,etc.Customized |
Process: | CNC Machining, Soldering, Nickle Plating, Leakage Testing |